IGEP COM MODULE DM3730/AM3703
Small module SINGLE core ARM Cortex-A8 up to 1000 MHz
The IGEP COM MODULE is an industrial processor board. It can be used as a computer-on-module for your product. The IGEP COM MODULE provides a lot of features in a small size. You can build your project anywhere you want.
Features |
|
Processor |
DM3730 / AM3703, by Texas Instruments |
3D/2D Accelerator |
PowerVR SGX GPU, providing graphics acceleration with OpenGL ES1.0, OpenGL ES2.0 and OpenVG support (Only in DM3730 version) |
Video |
Video acceleration: H.264, H.263, MPEG-4, MPEG-2, JPEG, WMV9 and additional codecs. Video encoder/decoder up to 720p (Only in DM3730 version) |
Memory |
RAM: Up to 512 MB Mobile DDR (Standard setup 512 MB) Flash: Up to 512 MB (Standard setup 512 MB) Onboard micro-SD card socket |
Ethernet |
No |
USB |
1 x USB 2.0 Host (connector not included) |
Display |
1 x Digital Video/TFT interface |
Image Capture Interface |
1 x CPI interface (12 bits) |
Wireless |
WiFi IEEE 802.11 b/g/n (Access Point: Yes) |
Antenna |
1 x Internal WiFi/Bluetooth antenna |
Additional Interfaces(Other combinations available, see Hardware Manual for more information) |
4 x UART |
SW Support |
Linux Android |
Power Supply |
Power from expansion connectors: From 3,5 V to 4,2 V Digital I/O voltage: 1,8 V |
Power Consumption |
Typical 1 W (depending on software) Maximum 2 W (depending on software) |
Thermal |
Commercial temperature: 0 ºC to +60 ºC Industrial temperature: -40 ºC to +85 ºC |
Form Factor |
18 mm x 68.5 mm Gumstix compatible |
Humidity |
93% relative Humidity at 40 ºC, non-condensing (according to IEC 60068-2-78) |
MTBF |
> 100000 hours |
Options |
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Processor |
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Grade |
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Main Memory |
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Flash Memory |
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Wireless |
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3D/2D Accelerator - Video |
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